72 ?2009 littelfuse, inc. speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. spa? silicon protection array products surface mount tvs avalanche diode array sp050xba lead-free/green series sp050xba lead-free/green series description features applications the surface mount family of arrays are designed to suppress esd and other transient overvoltage events. these arrays are used to meet the international electrotechnical compatibility (iec transient immunity standards iec 61000-4-2 for electrostatic discharge requirements). the series are used to help protect sensitive digital or analog input circuits on data, signal, or control lines with voltage levels up to 5vdc. the monolithic silicon arrays are comprised of specially designed structures for transient voltage suppression(tvs). the size and shape of these structures have be tailored for transient protection. the low capacitance and clamp voltage are ideal for high speed signal line protection. t . p c j m f q i p o f i b o e t f u t t 1 f s t p o b m % j h j u b m assistants (pda) t 1 p s u b c m f i b o e i f m e equipment (laptop, palmtop computers) t $ p n q v u f s q p s u
l f z c p b s e (usb1.1) t % j h j u b m t u j m m d b n f s b t t % j h j u b m w j e f p d b n f s b t t . 1 q m b z f s t pinout 1 2 3 SP0502BAHTG sp0502bajtg rohs pb green t " o " s s b z p g
p s 5 7 4 " w b m b o d i f % j p e f t j o b v m u s b small sc70, sot-23, sot-143, msop or tssop packages t & 4 % $ b q b c j m j u z 4 u b o e b s e t - iec 61000-4-2, direct discharge ........ 20kv ( level 4) - iec 61000-4-2, air discharge .............. 30kv ( level 4) - mil std 883 3015.7 ..........................................30kv t * o q v u 1 s p u f d u j p o g p s " q q m j d b u j p o t 6 q u p 7 % $ t ' b t u 3 f t q p o t f 5 j n f ..................................................<1ns t - p x * o q v u $ b q b d j u b o d f ...................................30pf typical t 0 q f s b u j o h 5 f n q f s b u v s f 3 b o h f ..................... -40oc to 85oc 1 2 3 4 sp0503bahtg 1 2 3 4 5 sp0504bahtg sp0504bajtg 1 2 3 4 6 5 sp0505bahtg 8 76 5 4 3 2 1 sp0504baatg 8 76 5 4 3 2 1 sp0506baatg sp0505bajtg hf
73 ?2009 littelfuse, inc. spa? silicon protection array products speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. surface mount tvs avalanche diode array sp050xba lead-free/green series lead-free/green sp050xba absolute maximum ratings parameter rating units storage temperature range -65 to + 150 oc package power dissipation sc70 sot23-3, sot23-5, sot23-6, sot143 tssop, msop 0.2 0.225 0.5 w w w electrical characteristics t a = +25oc, unless otherwise speci?ed parameter test conditions min typ max units reverse standoff voltage i r < = 1a - - 5.5 v reverse standoff leakage current v = 5.0v 1 100 na signal clamp voltage positive i = 10ma 5.6 6.8 8 v negative i = 10ma -1.2 -0.8 -0.4 v clamp voltage during esd mil-std-883 method 3015 (hbm) test + 8kv 12 v - 8kv -8 v esd test level (1) iec-61000-2, contact discharge 20 kv mil-std-883 method 3015 (hbm) 30 kv capacitance 2.5v @ 1mhz 30 pf turn on/off time <1 ns temperature range operating -40 85 oc storage -65 150 oc diode dynamic resistance forward conduction 1.0 reverse conduction 1.4 note: (1) esd voltage applied between channel pins and ground, one pin at a time; all other channel pins are open; all ground pins ar e grounded.
74 ?2009 littelfuse, inc. speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. spa? silicon protection array products surface mount tvs avalanche diode array sp050xba lead-free/green series typical input vi characteristics (pulse-mode measurements, pulse width = 0.7 ms nominal) 1. 6 1. 4 1. 2 1. 0 0.8 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 -0.8 -1.0 -1.2 -1.4 -1.6 input current (a) input voltage (v) 8 7 6 5 4 3 2 1 0 -1 -2 -3 9 typical diode capacitance vs. reverse voltage diode capacitance (pf) diode reverse voltage (v) 0 1 2 3 4 5 0 20 40 60 re?ow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 5c/second max t s(max) to t l - ramp-up rate 5c/second max re?ow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 250 +0/-5 c time within 5 c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 5c/second max time 2 5 c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters - wave soldering
75 ?2009 littelfuse, inc. spa? silicon protection array products speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. surface mount tvs avalanche diode array sp050xba lead-free/green series lead-free/green sp050xba package dimensions - sc70 e he 3 1 2 e b a1 a d c l a2 e 502 sp0502bajtg - sc70-3 package sc70-3 pins 3 jedec mo-203 issue a millimeters inches min max min max a 0.80 1.10 0.031 0.043 a1 0.00 0.10 0.00 0.004 a2 0.70 1.00 0.028 0.039 b 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 d 1.85 2.25 0.073 0.089 e 1.15 1.35 0.045 0.053 e 0.66 bsc 0.026 bsc he 2.00 2.40 0.079 0.094 l 0.26 0.46 0.010 0.018 e 5 4 1 2 3 l e he c b a1 a d a2 504 e sp0504bajtg - sc70-5 package sc70- 5 pins 5 jedec mo-203 issue a millimeters inches min max min max a 0.80 1.10 0.031 0.043 a1 0.00 0.10 0.00 0.004 a2 0.70 1.00 0.028 0.039 b 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 d 1.85 2.25 0.073 0.089 e 1.15 1.35 0.045 0.053 e 0.65 bsc 0.026 bsc he 2.00 2.40 0.079 0.094 l 0.26 0.46 0.010 0.018 b 1 2 3 4 5 6 e e he c l a1 a d a2 e 505 sp0505bajtg - sc70-6 package sc70-6 pins 6 jedec mo-203 issue a millimeters inches min max min max a 0.80 1.10 0.031 0.043 a1 0.00 0.10 0.00 0.004 a2 0.70 1.00 0.028 0.039 b 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 d 1.85 2.25 0.073 0.089 e 1.15 1.35 0.045 0.053 e 0.65 bsc 0.026 bsc he 2.00 2.40 0.079 0.094 l 0.26 0.46 0.010 0.018 m - 1.60 - 0.063 n - 1.30 - 0.051 o - 0.65 - 0.026 p - 0.70 - 0.028 r - 0.35 - 0.014 s - 0.90 - 0.035 t - 2.50 - 0.098 p t + ++ + ++ + s (ref) n (ref) m (ref) o (ref) r recommended pad layout
76 ?2009 littelfuse, inc. speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. spa? silicon protection array products surface mount tvs avalanche diode array sp050xba lead-free/green series e e1 e 3 1 2 e1 b a1 a d c l1 502b sp0502baht - sot23-3 package sot23-3 pins 3 jedec to-236 millimeters inches min max min max a 0.89 1.12 0.035 0.044 a1 0.01 0.1 0.0004 0.004 b 0.3 0.5 0.012 0.020 c 0.08 0.2 0.003 0.008 d 2.8 3.04 0.110 0.120 e 2.1 2.64 0.083 0.104 e1 1.2 1.4 0.047 0.055 e 0.95 bsc 0.038 bsc e1 1.90 bsc 0.075 bsc l1 0.54 ref 0.021 ref m 2.29 .090 n 0.95 0.038 o 0.78 .030typ p 0.78 .030typ p 0 n m package dimensions - sot23 e e1 5 4 1 2 3 l1 e1 e d a a1 c b 504b sp0504bahtg - sot23-5 package sot23- 5 pins 5 jedec mo-178 millimeters inches min max min max a - 1.45 - 0.057 a1 0 0.15 0 0.006 b 0.3 0.5 0.012 0.020 c 0.08 0.22 0.003 0.009 d 2.75 3.05 0.108 0.120 e 2.6 3.0 0.102 0.118 e1 1.45 1.75 0.057 0.069 e 0.95 bsc 0.038 bsc e1 1.90 bsc 0.075 bsc l1 0.60 ref 0.024 ref m 2.59 .102 n 0.95 .038 o 0.69 .027typ p 0.99 .039typ o p n m recommended pad layout recommended pad layout b 1 2 3 4 5 6 e e1 e 505b e1 l1 d a a1 c sp0505bahtg - sot23-6 package sot23-6 pins 6 jedec mo-178 millimeters inches min max min max a - 1.45 - 0.057 a1 0 0.15 0 0.006 b 0.3 0.5 0.012 0.020 c 0.08 0.22 0.003 0.009 d 2.75 3.05 0.108 0.120 e 2.6 3.0 0.102 0.118 e1 1.45 1.75 0.057 0.069 e 0.95 bsc 0.038 bsc e1 1.90 bsc 0.075 bsc l1 0.60 ref 0.024 ref m 2.59 .102 n 0.95 0.038 o 0.69 .027typ p 0.99 .039typ o p n m recommended pad layout
77 ?2009 littelfuse, inc. spa? silicon protection array products speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. surface mount tvs avalanche diode array sp050xba lead-free/green series lead-free/green sp050xba package dimensions - sot143 504 ba e l f d e1 a a1 c b l1 l2 sp0504baatg - tssop-8 package tssop-8 pins 8 millimeters inches min max min max d 2.90 3.10 0.114 .122 e 6.40 ref .252 ref e1 4.29 4.50 .17 .18 a 1.194 ref .047 ref a1 0.051 0.152 .002 0.006 b - 0.30 - 0.012typ c - 0.66 - typ l1 0.51 0.76 .020 .030 l2 0.102 0.203 .004 .008 506 b d e1 e a a1 b c l1 l2 l f sp0506baatg - msop-8 package msop-8 pins 8 millimeters inches min max min max d 2.90 3.10 0.114 .122 e 4.78 4.98 .188 .196 e1 2.90 3.10 .114 .122 a 0.87 1.17 .034 .046 a1 0.05 0.25 .002 0.010 b - 0.30typ - 0.012typ c - 0.65typ - 0.026typ l1 0.52 0.54 0.020 0.021 l2 - 0.18typ - .007typ f - 5.28 - .208 f1 - 4.24 - .167 g - 0.65 - 0.026 h - 0.38 - .015 i - 1.04 - .041 f1 f i h g recommended pad layout 503b e e1 c e e1 1 2 4 3 b2 b a1 a d l l1 sp0503bahtg - sot143-4 package sot143-4 pins 4 jedec to-2 5 3 millimeters inches min max min max a 0.08 1.22 0.003 0.048 a1 0.05 0.15 0.002 0.006 b 0.30 0.50 0.012 0.020 b2 0.76 0.89 0.030 0.035 c 0.08 0.20 0.003 0.008 d 2.80 3.04 0.110 0.120 e 2.10 2.64 0.082 0.104 e1 1.20 1.40 0.047 0.055 e 1.92 bsc 0.076 bsc e1 0.20 bsc 0.008 bsc l 0.4 0.6 0.016 0.024 l1 0.550 ref 0.022 ref 3.40 (.134") 3.60 (.140") 0.80 (.032") 1.00 (.040") 2.20 (.087") ref 1.90 (.075") 1.70 (.067") 1.00 (.040") 1.20 (.048") 0.80 (.032") 1.00 (.040") bsc max 1.40 (.055") recommended pad layout package dimensions - tssop package dimensions - msop
78 ?2009 littelfuse, inc. speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. spa? silicon protection array products surface mount tvs avalanche diode array sp050xba lead-free/green series part numbering system lead plating g green version - matte tin (sn); *non-green version - tin lead lead material copper alloy lead coplanarity 0.004 inches (0.102mm) subsitute material silicon body material molded epoxy flammability ul94-v-0 product characteristics ordering information part number ch package type quantity per reel SP0502BAHTG 2 sot23-3 3000 sp0503bahtg 3 sot143-4 3000 sp0504bahtg 4 sot23-5 3000 sp0505bahtg 5 sot23-6 3000 sp0504baatg 4 tssop-8 3000 sp0506baatg 6 msop-8 4000 sp0502bajtg 2 sc70-3 3000 sp0504bajtg 4 sc70-5 3000 sp0505bajtg 5 sc70-6 3000 notes: 1. all dimensions are in millimeters. 2. dimensions include solder plating. 3. dimensions are exclusive of mold ?ash & metal burr. 4. all speci?cations comply to jedec spec mo-203 issue a. 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. package surface matte ?nish vdi 11-13. sp 05 02 bah t g silicon protection array series number of channels 02 = 2 channel (sc70-3, sot23 packages) 03 = 3 channel (sot143 package) 04 = 4 channel (sc70-5, sot23-5, tssop-8 packages) 05 = 5 channel (sc70-6, sot23-6 packages) 06 = 6 channel (msop-8 package) package baa = msop-8 or tssop-8, 2500 qty bah = sot23-3, -5, -6 or sot143-4, 3000 qty baj = sc70-3, -5 or -6, 3000 qty t= tape & reel blank = not green/rohs/lead free* g= green/rohs/lead free product *note: to order non-green/rohs/lead free version of product, remove g at the end of part number .
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